Electric and Magnetic Field Coupling to PCB Transmission Lines and IC Packages

Electromagnetic compatibility (EMC) analysis of high-speed circuits is mandatory due to the rapid increase in operating frequencies, RF interference and PCB layout density. Radiated emission and immunity tests of electronic circuits and ICs are an important part of the overall EMC analysis and they have become a growing concern in prediction of an electronic system reliability. These tests are performed by a transverse electromagnetic (TEM) cell or IC-Stripline according to the standardized procedures. Depending on the layout of the trace connected to the IC and EM field intensity, induced voltages and currents can severely degrade signal integrity and system performance, and potentially even permanently damage sensitive components. The performance of the IC can be also compromised by induced voltages and currents on the IC package and onchip transmission lines. Thus, an accurate and fast analysis of electromagnetic coupling between the DUT and the TEM cell or IC-Stripline is of great importance.